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  1. Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services - Quik-Pak

    Same day packaging and custom assembly services. Utilize your own proprietary packaging designs.
    rapid prototyping2
    mems1
    bga1
    pick and place1
    flip chip1
    wire bonding1
    laser machining1
    radiation detector1
    ic packaging1
    wafer dicing1
    chip-on-board1
    ic assembly1
    ceramic packages1
    wafer thinning1
    die sort1
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    ic encapsulation1
    ic packages1
    stacked die1
    die thinning0
    ic prototypes0
    open cavity plastic package0
    wafer preparation0

    www.icproto.com - 2009-02-13

  2. CORWIL | Welcome to CORWIL

    Corwil Technology Corporation - Quality IC Assembly Services.
    package3
    cob1
    wafer1
    bga1
    mcm1
    lcc1
    mil-spec1
    soic1
    iso-90021
    plastic assembly1
    prototype assembly1
    wafer dicing1
    chip-on-board1
    ic assembly1
    ceramic packages1
    50051
    multi-chip modules1
    quad flatpacks1
    cerdips1
    jlcc1
    open cavity plastic1
    sidebraze1
    cerquads0
    dscc suitability letter0
    fine pitch bonding0
    heat sink studs0
    method 50040
    mil-std-883 certified0
    pin-down configurations0
    pin-up configurations0
    qml listed0

    www.corwil.com - 2009-02-12

  3. Majelac Technologies - IC Assembly and Packaging Services

    Majelac Technologies, Superior IC assembly services, dicing service, reballing, quick turn packaging
    packaging3
    package3
    wafer1
    bga1
    lcc1
    flip chip1
    soic1
    plastic assembly1
    prototype assembly1
    reballing1
    semiconductor packaging1
    IC packaging1
    wafer dicing1
    bga repair1
    BGA reballing1
    IC Assembly1
    semiconductor assembly1
    ceramic packages1
    electromigration1
    quad flatpacks1
    pbga1
    cerdips1
    jlcc1
    open cavity plastic1
    sidebraze1
    electro migration packaging0
    electro migration testing0
    fine-pitch bonding0
    quick-turn prototypes0

    www.majelac.com - 2009-02-04

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